HFP Series

FIBRE GLASS SUBSTRATE
SILICONE COATED WIRE WOUND
RESISTORS
DIRECT SNAP ON PCB MOUNTING
  • Choice of two terminals stand-off heights which are suitable for wave soldering
  • TCR as low as ± 200ppm/°C available
APPLICABLE STANDARDS - IS - 8909 and IEC 266

Physical configuration
 
CHOICE OF TERMINALS

HTR TYPE POWER RATING at 70°C  DIMENSIONS (mm) RESISTANCE RANGE  Wt Per PC '0' Terminal Wt Per PC '1' Terminal
L
+2/-1 		 D
±1 		 P
+2/-1 		 MIN MAX
F-2P 2W 18.2 5.0 10.2 R10 2K0
1.38
1.05
F-4P
4W
23.3
5.0
15.2
R38
3K0
1.70
1.25
F-5P
5W
33.4
5.0
25.4
R63
5K0
2.10
1.90
F-7P
6.5W
43.5 
5.0
35.4
R87
7K0
2.80
2.50
F-8P
8W
53.7
5.0
45.7
1R0 
9K0 
3.10 
2.91

Choice of Terminals
If the longer stand-off terminal is required, suffix the type with 'O' e.g. F-2 P-O to F-8 P-O.
If the shorter stand-off terminal is required, suffix the type with '1' e.g. F-2 P-1 to F-8 P-1.
Resistors with resistance value higher than the given range is possible using ceramic substrates
 

Electrical and Environmental Characteristics / Data
Test Performance Requirements
Resistance tolerance ± 10% [K] ± 5%[J] [< 1Ohm + 0.05Ohm]
Rated ambient temperature  [See derating curve] at 70°C full power dissipation
Temperature co-efficient ±200 ppm/°C [>10 Ohm]
±450 ppm/°C [<10 Ohm]
±600 ppm/°C [<1 Ohm]
Short time overload Max D R± [2% +0.05Ohm]
Moisture Resistance Max D R±[5% +0.05Ohm]
Load Life Max D R± [5% +0.05Ohm]
Ambient operating temperature range -25°C to +155°C

Derating Curve

(1) Body Temperature measuring point
(2) Solder joint measuring point

 Temperature Rise
TYPE TEMPERATURE AT FULL POWER DISSIPATION
MEASURING POINT 1 MEASURING POINT 2
HIGH RESISTANCE 
RANGE		 LOW RESISTANCE 
RANGE		 'O' TYPE
TERMINAL		 'I' TYPE
TERMINAL
F2P 230°C 180°C 50°C 70°C
F4P 285°C 235°C 83°C 98°C
F5P 285°C 240°C 50°C 85°C
F7P 292°C 260°C 45°C 85°C
F8P 290°C 246°C 55°C 80°C

 
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